Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits.
Interconnect Planning for Physical Design of 3D Integrated Circuits
This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3 ...
In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 122– 127. 23 Dittrich, M., Steinhardt, A., Heinig, A. et al. (2015). Characteristics and process stability of complete ...
This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the ...
H. Yu, Y. Shi, L. He, and T. Karnik, Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power. In Int. Symp. on Low Power Electronics and Design (ISLPED) (2006). H. Yu, J. Ho, and L. He, ...
Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology ...
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture.
Formally developed by A. E. Dunlop and B. W. Kernighan [4.8], terminal propagation considers external pin locations during partitioning-based placement. During min-cut placement, external connections are represented by artificial ...
The Handbook of Research on Emerging Trends and Applications of Machine Learning provides a high-level understanding of various machine learning algorithms along with modern tools and techniques using Artificial Intelligence.