Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
- ISBN-10
- 1566778638
- ISBN-13
- 9781566778633
- Category
- Integrated circuits
- Pages
- 377
- Language
- English
- Published
- 2011-04-25
- Publisher
- The Electrochemical Society
- Author
- F. Roozeboom
Description
This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.
Get the book
Similar books
-
Guidebook for Managing Silicon Chip Reliability
By Michael Pecht, Riko Radojcic, Gopal RaoGuidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
-
Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications
By John H. Lau, Shi-Wei Ricky LeeA revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field.
-
Chip Scale Package (CSP): Design, Materials, Processes, and Applications
By John H. Lau, Shi-Wei Ricky LeeThe first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT).
-
Photomask Technology 2015
By Naoya HayashiThese books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
-
An Industrial CMOS Process Family for Integrated Silicon Sensors
By Thomas MullerAn Industrial CMOS Process Family for Integrated Silicon Sensors
-
CMOS: 混合信号电路设计
本书主要包括数据转换器建模、数据转换器的信噪比、噪声整形数据转换器、亚微米CMOS电路设计、数据转换器的实现等内容。
-
CMOS VLSI設計原理: 系統上的透視
By Neil H. E. Weste, Kamran Eshraghian, 魏斯特CMOS VLSI設計原理: 系統上的透視
-
The Chip
By Peter JacksonExplores what silicon chips are, how they work, how they are designed and made, the different types of chips, and future development of chip technology.
-
芯片设计: 组合优化的特殊应用
By 越民义, 科尔特, Bernhard Korte本书以一种通俗的方式来解说一个芯片是怎样发挥它的作用, 以及如何用数学方法去设计的.
-
VLSI数字信号处理系统: 设计与实现
本书论述VLSI信号处理中性能优化技术,汇集了VLSI的架构理论与算法、描述了硬件实现层中的各种架构,给出了若干种分析、估计与降低功耗的方法 ...