GaAs MMIC Reliability - High Temperature Behavior
- ISBN-10
- 1933904100
- ISBN-13
- 9781933904108
- Language
- English
- Published
- 2006
- Publisher
- RIAC
- Authors
- Aris Christou, Willie M. Webb
Description
The sequence of design steps should not be confused with the sequence of manufacturing steps for the package, ... of Usable Geometries) Die Attachment Package Board Interconnection Package Architecture Metal/Ceramic/Plastic Package ...
