Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
- ISBN-10
- 3731507463
- ISBN-13
- 9783731507468
- Pages
- 256
- Language
- English
- Published
- 2018-02-09
- Publisher
- KIT Scientific Publishing
- Authors
- Nicole, Lindenmann
Description
This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
